CoolerMaster High Performance Thermal Paste
High-Performance Thermal Paste - Cooler Master HTK-002
The Cooler Master HTK-002 thermal paste is engineered for superior heat transfer. This high-performance, silicone-based compound is infused with thermally conductive metal oxides, delivering excellent heat conductivity, minimal bleed, and stable performance at high temperatures, up to 177°C (350°F). It maintains a strong seal between the heat sink and electronic device, optimizing heat dissipation and enhancing device efficiency.
Key Features:
- Versatile Use: Ideal for CPUs, chipsets, and VGA cards.
- Easy Application: Includes Zif socket templates for precise application with various CPU socket types.
- Even Application: Applicator ensures a uniform layer for optimal performance.
- Dielectric Properties: Safe for use with electronic components.
- Wide Temperature Range: Designed for stable performance across a broad temperature spectrum.
High-Performance Thermal Paste - Cooler Master HTK-002
The Cooler Master HTK-002 thermal paste is engineered for superior heat transfer. This high-performance, silicone-based compound is infused with thermally conductive metal oxides, delivering excellent heat conductivity, minimal bleed, and stable performance at high temperatures, up to 177°C (350°F). It maintains a strong seal between the heat sink and electronic device, optimizing heat dissipation and enhancing device efficiency.
Key Features:
- Versatile Use: Ideal for CPUs, chipsets, and VGA cards.
- Easy Application: Includes Zif socket templates for precise application with various CPU socket types.
- Even Application: Applicator ensures a uniform layer for optimal performance.
- Dielectric Properties: Safe for use with electronic components.
- Wide Temperature Range: Designed for stable performance across a broad temperature spectrum.
High-Performance Thermal Paste - Cooler Master HTK-002
The Cooler Master HTK-002 thermal paste is engineered for superior heat transfer. This high-performance, silicone-based compound is infused with thermally conductive metal oxides, delivering excellent heat conductivity, minimal bleed, and stable performance at high temperatures, up to 177°C (350°F). It maintains a strong seal between the heat sink and electronic device, optimizing heat dissipation and enhancing device efficiency.
Key Features:
- Versatile Use: Ideal for CPUs, chipsets, and VGA cards.
- Easy Application: Includes Zif socket templates for precise application with various CPU socket types.
- Even Application: Applicator ensures a uniform layer for optimal performance.
- Dielectric Properties: Safe for use with electronic components.
- Wide Temperature Range: Designed for stable performance across a broad temperature spectrum.